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The Global Electronics Association (formerly known as IPC) and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.
The MoU establishes a strategic collaboration focused on advancing advanced electronic packaging through:
Advisory & Insights – Global market trends and strategic guidance
Standards & Best Practices – Development of guidelines and standards
Capability Building – Co-hosted workshops and knowledge-sharing initiatives
Technical Support – Validation of design, assembly, and packaging technologies
Ecosystem Engagement – Collaboration with industry, academia, and government
This MoU builds on the Global Electronics Association’s growing presence in Malaysia, reflecting its commitment to supporting innovation and industry development in one of the region’s key electronics hubs.
